Wy helpe de wrâld groeiende sûnt 1983

Fabricating

PCB Assembly

ltem parameter remark
Minimum line spacing (mil) 3/3 Finished Koper thickness: 0.5OZ
Minimum ring breedte (mil) Mear as gat (Via Hole) 3mil 3mil (lc Hole) 3mil  
min Diafragma Plate thicknessBoard Thickness <2.0mm0.2mm Plate thicknessBoard Thickness <1.2mm0.1mm

Plate thicknessBoard Thickness ≤ 2.0mmThick diameter

Max Plate Thickness Single, dûbele board Multilayer 8.0mm Board8.0mm  
minimum dikte Single, dûbele board Fjouwer-laach Board0.2mm

Seis-laach board0.4mm

Acht-layer Board 10-Laach Board0.6mm

 
maksimum grutte Single, dûbele board Multilayer 600 * 1100mm Board600 * 1100mm  
Maksimum oantal lagen 46 Floors  
solder Green Oil Finster (MIL) 2/4
Green Oil Bridge (MIL) 4 Kleur: wyt,
swart, blau, grien, giel, read, ensfh
 
Personaazje Min line breedte (mil) 5/8
Kleur: wyt, giel, swart, ensfh
 
surface Coating Spuiten tin, electroplating nickel / goud, gemysk nickel / goud, immersion tin, immersion silver, anty-oksidaasje, spuiten suver tin, ensfh  
plate type FR4, hege frekwinsje plaat, PTFE, aluminium basis, koper basis, dikke copperfoil, halogen-frije materialen, Arlin, Rogers, Cem-1, cem-3 Mixed dielectric parse, fleksibele plaat, sêft en hurde Bonding plaat  

Manufa Cturing Prosessen



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