Peb pab lub ntiaj teb no loj hlob txij thaum 1983

fabricating

PCB los ua ke

ltem parameter hais
Yam tsawg kawg nkaus kab yov (mil) 3/3 Tiav lawm tooj liab thickness: 0.5OZ
Yam tsawg kawg nkaus lub nplhaib dav (mil) Nyob qhov (Ntawm Qhov) 3mil 3mil (LC Qhov) 3mil  
min Aperture Phaj thicknessBoard Thickness <2.0mm0.2mm Phaj thicknessBoard Thickness <1.2mm0.1mm

Phaj thicknessBoard Thickness ≤ 2.0mmThick txoj kab uas hla

Max Phaj Thickness Ib zaug xwb, muab ob npaug rau board multilayer 8.0mm Board8.0mm  
Yam tsawg kawg nkaus thickness Ib zaug xwb, muab ob npaug rau board Plaub-txheej Board0.2mm

Rau-txheej board0.4mm

Yim-txheej Board 10-Txheej Board0.6mm

 
Maximum loj Ib zaug xwb, muab ob npaug rau board multilayer 600 * 1100mm Board600 * 1100mm  
Tsawg ntawm cov khaubncaws sab nraud povtseg 46 plag tsev  
Solder Ntsuab Roj Qhov rai (MIL) 2/4
Ntsuab Roj choj (MIL) 4 Xim: dawb,
dub, xiav, ntsuab, daj, liab, thiab lwm yam
 
Ximxoo Min kab dav (mil) 5/8
xim: dawb, daj, dub, thiab lwm yam
 
Deg Txheej Txau tin, electroplating npib tsib xee / kub, tshuaj npib tsib xee / kub, immersion tin, immersion nyiaj, anti-oxidation, txau ntshiab tin, etc.  
Phaj hom FR4, high-zaus phaj, PTFE, txhuas puag, tooj liab puag, tuab copperfoil, halogen-free cov ntaub ntawv, Arlin, Rogers, Cem-1, cem-3 Mixed dielectric xovxwm, saj zawg zog phaj, mos mos thiab nyuaj tsevneeg phaj  

Manufa Cturing dab



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