Kami ay makakatulong sa mundo lumalagong dahil 1983

fabricating

PCB Assembly

ltem parametro pangungusap
Minimum line spacing (mil) 3/3 Tapos tanso kapal: 0.5oz
Minimum ring lapad (mil) Sa paglipas ng butas (Via Hole) 3mil 3mil (lc Hole) 3mil  
Min Aperture Plate thicknessBoard Kapal <2.0mm0.2mm Plate thicknessBoard Kapal <1.2mm0.1mm

Plate thicknessBoard Kapal ≤ 2.0mmThick diameter

Max Plate Kapal Single, double board Multilayer 8.0mm Board8.0mm  
Minimum kapal Single, double board Apat na layer Board0.2mm

Six-layer board0.4mm

Eight-layer Board 10-Layer Board0.6mm

 
maximum na laki Single, double board Multilayer 600 * 1100mm Board600 * 1100mm  
Maximum na bilang ng mga layer 46 Floors  
panghinang Green Oil Window (MIL) 2/4
Green Oil Bridge (MIL) 4 Kulay: puti,
itim, asul, berde, dilaw, pula, atbp
 
pagkatao Min lapad ng linya (mil) 5/8
Kulay: puti, dilaw, itim, atbp
 
Surface Coating Pag-spray lata, electroplating magtubog sa nikel / gold, kemikal nikelado / ginto, immersion lata, immersion pilak, anti-oksihenasyon, pag-spray ng purong lata, at iba pa  
type plate FR4, mataas na dalas ng plato, PTFE, aluminum base, tanso base, makapal copperfoil, halogen-free materyales, Arlin, Rogers, Cem-1, cem-3 Mixed dielectric press, may kakayahang umangkop plate, soft at mahirap bonding plate  

Manufa Cturing Proseso



WhatsApp Online Chat !